EFFECT Photonics is a technology scale-up founded in Eindhoven. We develop highly sophisticated optical sub-assemblies (OSAs), including, among others, high-performance lasers for the data- and telecommunications market.

We are seeking a highly proactive and solution-oriented Semiconductor Foundry Process Development Engineer to bridge the gap between our design requirements and wafer foundry partners. The ideal candidate must not only possess deep technical expertise in photonics GaAs/InP processes but also demonstrate strong ownership in driving projects to completion, meeting strict deadlines, and maintaining uncompromising quality standards.

In this role you will drive the development and continuous improvement of process platforms by collaborating with PIC designers and suppliers, ensuring robust qualification and release standards. You will strengthen product reliability and delivery performance through rigorous root cause analysis, supplier oversight, and proactive risk management across the supply chain. Furthermore, you will optimize quality and yield using data-driven insights, resolving production issues, and implementing corrective actions to consistently achieve high process capability. Education & Experience

• Experience: Minimum 5 years of hands-on experience in the laser/optoelectronics industry, OR a Ph.D. degree with a research focus in integrated photonics or semiconductor lasers with 3 years of industry experience.
• Preferred Disciplines: Photonics, Electrical Engineering, Applied Physics, or Materials Science.

Technical Knowledge & Skills

• Semiconductor Fabrication Processes: Deep understanding of front-end-of-line (FEOL) wafer fabrication processes specific to compound semiconductors or silicon photonics (e.g., epitaxy, lithography, dry/wet etching, thin-film deposition, and metallization).
• Laser Technology: Solid grasp of InP (Indium Phosphide) or GaAs processing, laser physics (DFB, FP, or VCSEL structures), and the unique challenges of integrating active optical components on-wafer.
• Optical & Electrical Measurement (Plus): Familiarity with optical characterization techniques (e.g., spectrum analysis, laser light-current-voltage (LIV) testing, near-field/far-field profiling, and optical wafer-level probing).

Language & Communication

• Professional English Proficiency: Excellent written and verbal communication skills. Must be fully capable of writing technical 8D reports, reviewing foundry process flows, and leading alignment meetings with international fabrication supplier

Core Competencies (How You Work)

• Proactive Project Driving: Take full responsibility for the production wafer sign-off, and qualification timelines.
• Cross-Functional Support: Support PIC design team, Validation team with an open mindset. Value feedback from the pouring deck as much as data from a VI, lesson learnt from past process issue.
• Constructive Problem Solving: Approach manufacturing disagreements or unexpected casting defects with curiosity and a focus on root causes, avoiding blame.
• Data-Driven Decision Making: Rely on empirical data, mechanical testing, and statistical process control (SPC) rather than "gut feeling" or traditional folklore when modifying process condition or design changes

Yield & Data Analysis (Yield Engineering)

• Wafer Probe Analysis: Analyze wafer sort/probe electrical test data to identify yield fallout, trend shifts, and perform Root Cause Analysis (RCA) for failed parametric or functional tests.
• In-Line & Inspection Data Correlation: Review fabrication in-line defect density data, parametric monitor data, and visual inspection reports to correlate fab-level anomalies with final electrical performance.
• Incoming Quality Control: Perform visual and physical inspections of incoming wafers to ensure compliance with quality and packaging specifications.

Failure Analysis & Continuous Improvement (FA / QA)

• 8D Problem Solving: Lead formal Root Cause Analysis (RCA) investigations for process and yield failures using the structured 8D report format, driving corrective and preventive actions (CAPA) with the fabrication supplier.
• Reliability Support: Partner with Reliability Testing teams to investigate qualification or lifetime failures (e.g., HTOL, HAST) and determine process-related root causes.

Design-Technology Co-Optimization (DFM)

• Design for Manufacturing (DFM): Participate in chip design reviews and drive DFM activities to optimize layout patterns, minimize lithography hotspots, and ensure high yield stability before tape-out.

Foundry Management & Supply Chain Follow-up

• WIP & Progress Tracking: Closely monitor foundry Work-in-Progress (WIP), wafer fabrication cycle times, and log progress to ensure on-time delivery of engineering samples and production lots.
• Supplier Interface: Serve as the technical point of contact to follow up on wafer fabrication process flows, process changes (PCNs), and manufacturing deviations with the external semiconductor foundry