Senior Staff InP Process Integration Engineer (Foundry Management)
EFFECT Photonics
Taiwan
Posted on May 13, 2026
EFFECT Photonics is a technology scale-up founded in Eindhoven. We develop highly sophisticated optical sub-assemblies (OSAs), including, among others, high-performance lasers for the telecommunications market, built around integrated photonics chips on the indium phosphide platform.
We are seeking a highly proactive and solution-oriented Process Integration Engineer for our Taiwan office to bridge the gap between our design requirements and Taiwan foundry partners. The ideal candidate must not only possess deep technical expertise in photonics GaAs/InP processes but also demonstrate strong ownership in driving projects to completion, meeting strict deadlines, and maintaining uncompromising quality standards.
We are seeking a highly proactive and solution-oriented Process Integration Engineer for our Taiwan office to bridge the gap between our design requirements and Taiwan foundry partners. The ideal candidate must not only possess deep technical expertise in photonics GaAs/InP processes but also demonstrate strong ownership in driving projects to completion, meeting strict deadlines, and maintaining uncompromising quality standards.
- Technical Foundation: Basic concepts of semiconductor devices (LD, leakage, Junction concept).
- Domain Expertise: Hands-on experience in GaAs/InP process development or engineering for PIC or LD devices.
- Problem-Solving Mindset: Demonstrates a "can-do" attitude and strong analytical skills. We value candidates who focus on "how to solve" rather than "why it cannot be done."
- Proactive Communication: Ability to provide transparent, real-time updates and escalate issues with proposed solutions (not just problems).
- Quality Tools: Proficient in FMEA, Cpk, and SPC will be plus points.
- Professional: preferred area is Process Integration + Customer Service Engineer (CSE), Account technical manager or engineer, Fab experience
- Education:
- Minimum of a M.S degree in Electrical Engineering, Materials Science, Physics, or a related technical field preferred PhD degree
- Solid academic foundation in semiconductor device physics (especially Compound Semiconductors like GaAs/InP) and optoelectronics.
- Relevant coursework or research experience in wafer fabrication processes, device characterization, and statistical analysis.
- 10 years experience at Taiwan semiconductor Fab or Experiences in chip layout review a strong plus
- Experience in international/multicultural work environments (e.g., US, European, or Korean companies) with a fast-paced work culture.
- Proven track record of managing foundry partners under tight schedules and high-pressure situations.
- Language: Fluent in Mandarin and Professional English (written and verbal).
- Serve as the primary technical point of contact for PIC fabrication process in Taiwan, providing immediate and clear technical direction.
- Lead regular engineering review meetings with supplier; ensure all action items are tracked, followed up, and closed with concrete results, not just status updates.
- Collaborate with PIC designers and suppliers to build new process platforms.
- Specify reliability and qualification requirements, structure the platform release process with minimal supervision.
- Supervise and Audit failure analysis (FA) and root cause analysis (RCA) at the supplier side; ensure that "excuses" are replaced with verifiable technical solutions.
- Closely support the supply chain or operation group to ensure the delivery schedule is met through proactive risk management.
- Monitor quality issues and interface proactively with the fab to resolve bottlenecks.
- Deep dive in Trend Analysis: Track and review production lot PCM/inline trend charts. Implement corrective actions to improve Cpk, with a relentless focus on achieving high Cpk value as much as possible.
- Drive and manage the full cycle of process development projects with Taiwan foundry partners, ensuring a seamless transition from process freeze, Product qualification and Production.
- Ownership of Deadlines: Take full responsibility for the product tape-out schedule and qualification timeline; proactively identify and mitigate potential delays before they impact the critical path.